news & events

The FlexRay Consortium's presentation from this year´s FlexRay ProductDay "The quintessence of the current FlexRay Consortium activities" by Dr. Christopher Temple is available for download!

29 November 2007 in Fellbach near Stuttgart
 
Again a very successful event: More than 380 participants could be welcome. The worldwide professionals from the automotive industry used the FlexRay ProductDay to get latest information about FlexRay in general, product solutions, and applications that have already been realized.
 
The kick off of the ProductDay was again the Networking event on the evening of 28 November. The majority of the participants used this event for personal contacts with exhibitors and speakers.
 
The event continued on 29 November with numerous professional presentations and the technical programme comprised contributions by

• Agilent Technologie
• EB (formerly DECOMSYS)
• ETAS GmbH 
• Synopsys GmbH
• C&S group
• Volkswagen AG
• TÜV NORD Mobilität, Institut für Fahrzeugtechnik & Mobilität
• TZ Mikroelektronik
• University of Applied Sciences Zwickau, Research and Transfer Center
• Vector Informatik GmbH
• Yazaki Europe Ltd.

For further information please have a look at the complete programme at www.flexray-productday.de!
 
The following companies took part as exhibit

• Agilent Technologies
• Austrian Research Centers GmbH 
• austriamicrosystems AG 
• BERATA GmbH 
• Bertrandt AG 
• CANway technology GmbH 
• Carmeq GmbH 
• C&S Group 
• dSPACE GmbH 
• ETAS GmbH 
• Freescale Halbleiter Deutschland GmbH 
• Fujitsu Microelectronics Europe GmbH 
• GIGATRONIK GmbH 
• INCHRON GmbH 
• IXXAT Automation GmbH 
• Murata Manufacturing Co., Ltd. 
• NEC Electronics (Europe) GmbH 
• NXP Semiconductors 
• preeTEC – Wolfgang Pree GmbH 
• samtec automotive software & electronics GmbH 
• Softing AG 
• Symtavision GmbH 
• TTTech Computertechnik AG 
• TÜV NORD Mobilität GmbH & Co. KG – IFM 
• TZ Mikroelektronik 
• Vector Informatik GmbH 
• Yokogawa Electric Corporation

Please visit http://www.hanser.com to obtain further informations (e.g. request accompanying documents).
 

The FlexRay V2.1 Protocol and Physical Layer Conformance Tests have been released in February 2007.
 
These two conformance tests complete the FlexRay V2.1 specification set that was published in December 2005. With the conformance tests released, semiconductor suppliers can submit their silicon solutions such as communication controllers and physical layer devices to the conformance test partners. Upon successful completion of the test, these devices will be qualified as conforming to the FlexRay V2.1 standard.
 
The Electrical Physical Layer Conformance Test Specification 2.1 Rev.A can be requested here!

The FlexRay Consortium has finalized new versions of the FlexRay Communications System Specifications. These Specifications are available to the general public on the FlexRay Consortium homepage.
 
The FlexRay Communications System Specifications can be requested here!

The previous FlexRay Consortium agreements expired on December 31, 2005. To ensure seamless continuation of the FlexRay Consortium the seven Core Partners (BMW, Bosch, DaimlerChrysler, Freescale, General Motors, NXP Semiconductors, Volkswagen) agreed on continuation agreements for the timeframe from January 1, 2006, until December 31, 2008. 

• Existing FlexRay Consortium Members need to prolong their membership by signing a continuation member agreement.
• New members can apply for membership by sending an application to request@flexray.com as described under How to join?

During the timeframe 2006-2008 the FlexRay Consortium will focus on the following main tasks:

• Ensure conformance of FlexRay devices 
• Encourage commercial exploitation of the FlexRay system
• Extend the technical specifications to cover additional specific application domains